Three-dimensional injection molded circuit components use MID (Molded Interconnect Device) technology. Further advancements use proprietary surface activation technology and laser patterning. The result is a 3D circuit device with a fine circuit pattern for mounting bare chips. Custom shapes and patterns are produced on an order request basis.
Connectors: MIPTEC 3D Packaging Technology
In order to download the selected file, please check and accept our terms and conditions (*pdf file).