Surface Mount Technology: NPM-W

NPM-W design engineers Panasonic
NPM-W Flexible & Wide Board Assembly Platform

NPM-W versatile and wide board assembly platform

A member Panasonic's award-winning NPM platform, the NPM-W (Next Production Modular - Wide) is the ideal solution to fulfil your expanding and evolving electronics assembly requirements.

It can process large board sizes up to 750 x 550 mm (29.5 x 21.6") format and place large connectors (up to 150 x 25 mm) and components (up to 120 x 90 mm) while at the same time it has capacity for up to 120 feeder inputs. These are just several features that make the NPM-W particularly advantageous for high mix manufacturing.

It is a also a versatile complement to any SMT manufacturing line thanks to the option of numerous placement head combinations and supply methods –irrespective of the size of the board. The intelligent fluxing unit accommodates PoP components from both tape and tray and provides the required feeder inputs. 3D sensing and chip thickness processing technologies, for example, are also an option. A near zero loss changeover is made possible through progressive changeover, gang nozzle exchange and feeder anywhere.

Options for LED assembly to support brightness uniformity and bad mark recognition without impacting speed are also special features of the NPM-W.

Advantages:

  • Length of 1280 mm with 70,000 cph
  • Offers compatibility with CM and NPM-D series intelligent feeders and nozzles
  • Brightness binning for LED applications
  • Supply options from 3 components
  • Versatile feeder positions

Features & Benefits

High area productivity with total mounting lines
Higher productivity and quality with printing, placement and inspection process integration

For larger boards and larger components
PCBs up to a size of 750 × 550 mm with component range up to 150 × 25 mm

Higher area productivity through dual lane placement (Selection spec.)
Depending on the PCB you produce, you can select an optimal placement mode - "Independent" "Alternate" or "Hybrid"

Specifications

Model ID
NPM-W
Rear head
Front head
16-nozzle head
12-nozzle head
8-nozzle head
3-nozzle head
Dispensing head
No head
16-nozzle head
NM-EJM2D
NM-EJM2D-MD
NM-EJM2D
12-nozzle head
8-nozzle head
3-nozzle head
Dispensing head
NM-EJM2D-MD
-
NM-EJM2D-D
Inspection head
NM-EJM2D-MA
NM-EJM2D-A
No head
NM-EJM2D
NM-EJM2D-D
-
 
PCB
dimensions
(mm)
Single-lane
mode*1
Batch
mounting
L 50 x W50 ~ L 750 x W 550
2-positin
mounting
L 50 x W50 ~ L 350 x W 550
Dual-lane
mode*1
Single
transfer
L 50 x W50 ~ L 750 x W 510
Dual
transfer
L 50 x W50 ~ L 750 x W 260
PCB
exchange
time
Single-lane
mode*1
Batch
mounting
4.4s ( With no component mounted on the reverse side of PCB )
2-positin
mounting
2.3s ( With no component mounted on the reverse side of PCB )
Dual-lane
mode*1
Single
transfer
4.4s ( With no component mounted on the reverse side of PCB )
Dual
transfer
0s*
*No 0s when cycle time is 4.4 s or less
Electric source3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA
Pneumatic source *20.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm)W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass2 250 kg (Only for main body:This differs depending on the option configuration.)

 

Placement head16-nozzle head
( With Dual Heads )
12-nozzle head
( With Dual Heads )
8-nozzle head
( With Dual Heads )
3-nozzle head
( With Dual Heads )
Placement speed70 000cph
(0.051 s/ chip)
62 500cph
(0.058 s/ chip)
40 000cph
(0.090 s/ chip)
11 000 cph (0.33 s/ QFP)
IPC9850 (1608)53 800 cph*848 000 cph*8--
Placement accuracy
(Cpk1)
± 40 µm/chip± 40 µm/chip
± 30 µm/QFP 12mm to 32mm
± 50 µm/QFP 12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
(01005") 0402 chip*6 to L 6 x W 6 x T 3(01005") 0402 chip*6 to L 12 x W 12 x T 6.5(01005") 0402 chip*6 to L 32 x W 32 x T 12(0201'')0603 chip to L 150 × W 25 (diagonal152) × T 28
Component
supply
TapingTape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mmTape : 8 to 56 / 72 mmTape : 8 to 56 / 72 / 88 / 104 mm
Max.120
( 8 mm tape : double feeder, (small real) )
Front/rear feeder cart specifications : Max.120
 ( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick-Front/rear feeder cart specifications : Max.14
Single tray specifications : Max.10
Twin tray specifications : Max.7
Tray-Single tray specifications : Max.20
Twin tray specifications : Max.40
Dispensing headDot dispensingDraw dispensing
Dispensing speed0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)3.75 s/component (Condition: 30 mm x 30 mm corner dispensing)
Adhesive position accuracy (Cpk1)± 75 μ m /dot± 100 μ m /component
Applicable components1608 chip to SOP,PLCC,QFP, Connector, BGA, CSPSOP,PLCC,QFP, Connector, BGA, CSP
Inspection head2D inspection head (A)2D inspection head (B)
Resolution18 µm9 µm
View size (mm)44.4 x 37.221.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 / 0201" or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 / 01005" or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, MelfSquare chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection *9
Inspection position accuracy *11
( Cpk1)
± 20 μm± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine

*1 : Please consult us separately should you connect it to NPM-D. It cannot be connected to NPM-TT and NPM.
*2 : Only for main body
*3 : 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
*4 : Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm
*5 : Excluding monitor and signal tower
*6 : The 0402 chip requires a specific nozzle/feeder.
*7 : 3-nozzle head cannot be installed to NPM-D.
*8 : It is the reference value of an IPC9850-compliant tact time estimated in the dual conveyor/independent mode.
*9 : Foreign object is available to chip components.
*10 : One head cannot handle solder inspection and component inspection at the same time.
*11 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.