Surface Mount Technology: NPM-D3
Going beyond the innovations of the award-winning NPM Series, the new NPM-D3 is the ideal solution for evolving electronics assembly requirements. Complementing the interchangeable, plug-and-play placement heads, the NPM-D3 also integrates ADH (adhesive dispense), SPI (solder paste inspection) and AOI (post placement inspection). The innovative single-unit camera is an industry first with its ability to check alignment, thickness, and coplanarity.
To optimise the benefits of the dual lane configuration, all heads operate on both placement areas. The system converts to single-lane for boards up to 650 x 510 mm (25 x 20”) alternatively.
A part range of 03015 mm microchips to 6” long connectors and up to 28 mm tall are supported by the flexible placement heads support. Area productivity is impressively close to 26,300 cph per sq m. Heads and functions can be changed depending on the production demands. Lean assembly, maximum productivity, and impressive investment protection are the outstanding features offered by the NPM-D3.
The NPM-W for hybrid volume applications and the dual tray NPM-TT are further members of the NPM line.
Features & Benefits
High area productivity with total mounting lines
Higher productivity and quality with placement and inspection process integration.
Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.
Comprehensive control of lines, floor and factory with system software
Production plan support through line operation monitoring.
Rear headFront head
|Lightweight 16-nozzle head|
|L 50 x W50 ~ L 510 x W 300|
|L 50 x W50 ~ L 510 x W 590|
|0 s* *No 0s when cycle time is 3.6 s or less|
|3.6 s* *When selecting short conveyors|
|Electric source||3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA|
|Pneumatic source *2||0.5 MPa, 100 L /min (A.N.R.)|
|Dimensions *2 (mm)||W 832 x D 2 652 *3 x H 1 444 *4|
|Mass||1 680 kg (Only for main body:This differs depending on the option configuration.)|
|Placement head||Lightweight 16-nozzle head|
( With Dual Heads )
( With Dual Heads )
( With Dual Heads )
( With Dual Heads )
|High production mode [ON]||High production mode [OFF]|
|84 000 cph|
(0.043 s/ chip )
|76 000 cph|
(0.047 s/ chip )
|69 000 cph|
(0.052 s/ chip )
|43 000 cph|
(0.084 s/ chip )
|11 000 cph|
(0.327 s/ chip )
8 500 cph
(0.423 s/ QFP)
|63 300 cph*5||57 800 cph*5||50 700 cph*5||-||-|
|± 40 µm/chip||±30 μm / chip|
(±25 μm / chip*6)
|±30 μm / chip||± 30 µm/chip|
± 30 µm/QFP
± 50 µm/QFP
|± 30 µm/QFP|
|(01005") 0402 chip*7 to L 6 x W 6 x T 3||03015"*7*8/(01005") 0402 chip*7 to L 6 x W 6 x T 3||(01005") 0402 chip*7 to L 12 x W 12 x T 6.5||(01005") 0402 chip*7 to L 32 x W 32 x T 12||(0201") 0603 chip to L 100 x W 90 x T 28|
|Taping||Tape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mm||Tape : 8 to 56 / 72 / 88 / 104 mm|
|8 mm tape : Max. 68 (8 mm thin type single feeder, double tape feeder, small reel)|
|Stick,Tray||-||Stick : Max. 8|
Tray : Max. 20 (per tray feeder)
|Dispensing head||Dot dispensing||Draw dispensing|
|Dispensing speed||0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)||4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*13|
|Adhesive position accuracy (Cpk1)||± 75 μ m /dot||± 100 μ m /component|
|Applicable components||1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP||SOP,PLCC,QFP, Connector, BGA, CSP|
|Inspection head||2D inspection head (A)||2D inspection head (B)|
|Resolution||18 µm||9 µm|
|View size (mm)||44.4 x 37.2||21.1 x 17.6|
|0.35s/ View size|
|0.5s/ View size|
|Chip component : 100 μm x 150 μm or more (0603 / 0201" or more)|
Package component : φ150 μm or more
|Chip component : 80 μm x 120 μm or more (0402 / 01005" or more)|
Package component : φ120 μm or more
|Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10||Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10|
|Oozing, blur, misalignment, abnormal shape, bridging|
|Missing, shift, flipping, polarity, foreign object inspection *11|
|Inspection position accuracy *12|
|± 20 μm||± 10 μm|
|Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)|
|Max. 10 000 pcs./machine|
*1 : Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) dual lane specs cannot be established.
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 : Excluding monitor and signal tower
*5 : It is the reference value of the tact time by the IPC9850 conformity. (The independent mode)
*6 : ±25 μm placement support option.(Under conditions specified by PFSC)
*7 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFC : Placement accuracy ±30 μm / chip )
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*13 : A PCB height measurement time of 0.5s is included.
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
In order to download the selected file, please check and accept our terms and conditions (*pdf file).
PIDEU_GT&Cs for Engineering Tools.pdf