Surface Mount Technology: NPM-D3

NPM-D3 design engineers Panasonic
Surface Mount Technonlogy NPM-D2

Going beyond the innovations of the award-winning NPM Series, the new NPM-D3 is the ideal solution for evolving electronics assembly requirements. Complementing the interchangeable, plug-and-play placement heads, the NPM-D3 also integrates ADH (adhesive dispense), SPI (solder paste inspection) and AOI (post placement inspection). The innovative single-unit camera is an industry first with its ability to check alignment, thickness, and coplanarity.

To optimise the benefits of the dual lane configuration, all heads operate on both placement areas. The system converts to single-lane for boards up to 650 x 510 mm (25 x 20”) alternatively.

A part range of 03015 mm microchips to 6” long connectors and up to 28 mm tall are supported by the flexible placement heads support. Area productivity is impressively close to 26,300 cph per sq m. Heads and functions can be changed depending on the production demands. Lean assembly, maximum productivity, and impressive investment protection are the outstanding features offered by the NPM-D3.

The NPM-W for hybrid volume applications and the dual tray NPM-TT are further members of the NPM line.

Features & Benefits

High area productivity with total mounting lines
Higher productivity and quality with placement and inspection process integration.

Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.

Comprehensive control of lines, floor and factory with system software
Production plan support through line operation monitoring.

Specifications

Model ID
NPM-D3
Rear head
Front head
Lightweight
16-nozzle head
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head
No head
Lightweight 16-nozzle head
NM-EJM6D
NM-EJM6D-MD
NM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head
NM-EJM6D-MD
-
NM-EJM6D-D
Inspection head
NM-EJM6D-MA
NM-EJM6D-A
No head
NM-EJM6D
NM-EJM6D-D
-
PCB
dimensions*1
(mm)
Dual-lane
mode
L 50 x W50 ~ L 510 x W 300
Single-lane
mode
L 50 x W50 ~ L 510 x W 590
PCB
exchange
time
Dual-lane
mode
0 s* *No 0s when cycle time is 3.6 s or less
Single-lane
mode
3.6 s* *When selecting short conveyors
Electric source3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source *20.5 MPa, 100 L /min (A.N.R.)
Dimensions *2 (mm)W 832 x D 2 652 *3 x H 1 444 *4
Mass1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement headLightweight 16-nozzle head
( With Dual Heads )
12-nozzle head
( With Dual Heads )
8-nozzle head
( With Dual Heads )
2-nozzle head
( With Dual Heads )
High production mode [ON]High production mode [OFF]
Placement speedMax.
speed
84 000 cph
(0.043 s/ chip )
76 000 cph
(0.047 s/ chip )
69 000 cph
(0.052 s/ chip )
43 000 cph
(0.084 s/ chip )
11 000 cph
(0.327 s/ chip )
8 500 cph
(0.423 s/ QFP)
IPC9850
(1608)
63 300 cph*557 800 cph*550 700 cph*5--
Placement accuracy
(Cpk1)
± 40 µm/chip±30 μm / chip
(±25 μm / chip*6)
±30 μm / chip± 30 µm/chip
± 30 µm/QFP
12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
(01005") 0402 chip*7 to L 6 x W 6 x T 303015"*7*8/(01005") 0402 chip*7 to L 6 x W 6 x T 3(01005") 0402 chip*7 to L 12 x W 12 x T 6.5(01005") 0402 chip*7 to L 32 x W 32 x T 12(0201") 0603 chip to L 100 x W 90 x T 28
Component
supply
TapingTape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mmTape : 8 to 56 / 72 / 88 / 104 mm
8 mm tape : Max. 68 (8 mm thin type single feeder, double tape feeder, small reel)
Stick,Tray-Stick : Max. 8
Tray : Max. 20 (per tray feeder)

Dispensing headDot dispensingDraw dispensing
Dispensing speed0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*13
Adhesive position accuracy (Cpk1)± 75 μ m /dot± 100 μ m /component
Applicable components1608 chip to SOP,PLCC,QFP, Connector, BGA, CSPSOP,PLCC,QFP, Connector, BGA, CSP

Inspection head2D inspection head (A)2D inspection head (B)
Resolution18 µm9 µm
View size (mm)44.4 x 37.221.1 x 17.6
Inspection
processing
time
Solder
Inspection *9
0.35s/ View size
Component
Inspection *9
0.5s/ View size
Inspection
object
Solder
Inspection *9
Chip component : 100 μm x 150 μm or more (0603 / 0201" or more)
Package component : φ150 μm or more
Chip component : 80 μm x 120 μm or more (0402 / 01005" or more)
Package component : φ120 μm or more
Component
Inspection *9
Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection
items
Solder
Inspection *9
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *9
Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12
( Cpk1)
± 20 μm± 10 μm
No. of
inspection
Solder
Inspection *9
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *9
Max. 10 000 pcs./machine

*1 : Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) dual lane specs cannot be established.
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 : Excluding monitor and signal tower
*5 : It is the reference value of the tact time by the IPC9850 conformity. (The independent mode)
*6 : ±25 μm placement support option.(Under conditions specified by PFSC)
*7 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFC : Placement accuracy ±30 μm / chip )
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*13 : A PCB height measurement time of 0.5s is included.
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.