Features & Benefits
High area productivity with total mounting lines
Higher productivity and quality with placement and inspection process integration.
Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.
Comprehensive control of lines, floor and factory with system software
Production plan support through line operation monitoring.
Specifications
| Model ID | NPM-D3 |
Rear head Front head | Lightweight
16-nozzle head | 12-nozzle head | 8-nozzle head | 2-nozzle head | Dispensing head | No head |
| Lightweight 16-nozzle head | NM-EJM6D | NM-EJM6D-MD | NM-EJM6D |
| 12-nozzle head |
| 8-nozzle head |
| 2-nozzle head |
| Dispensing head | NM-EJM6D-MD | - | NM-EJM6D-D |
| Inspection head | NM-EJM6D-MA | NM-EJM6D-A |
| No head | NM-EJM6D | NM-EJM6D-D | - |
 |
PCB
dimensions*1
(mm) | Dual-lane
mode | L 50 x W50 ~ L 510 x W 300 |
Single-lane
mode | L 50 x W50 ~ L 510 x W 590 |
PCB
exchange
time | Dual-lane
mode | 0 s* *No 0s when cycle time is 3.6 s or less |
Single-lane
mode | 3.6 s* *When selecting short conveyors |
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA |
| Pneumatic source *2 | 0.5 MPa, 100 L /min (A.N.R.) |
| Dimensions *2 (mm) | W 832 x D 2 652 *3 x H 1 444 *4 |
| Mass | 1 680 kg (Only for main body:This differs depending on the option configuration.) |
| Placement head | Lightweight 16-nozzle head
( With Dual Heads ) | 12-nozzle head
( With Dual Heads ) | 8-nozzle head
( With Dual Heads ) | 2-nozzle head
( With Dual Heads ) |
| High production mode [ON] | High production mode [OFF] |
| Placement speed | Max.
speed | 84 000 cph
(0.043 s/ chip ) | 76 000 cph
(0.047 s/ chip ) | 69 000 cph
(0.052 s/ chip ) | 43 000 cph
(0.084 s/ chip ) | 11 000 cph
(0.327 s/ chip )
8 500 cph
(0.423 s/ QFP) |
IPC9850
(1608) | 63 300 cph*5 | 57 800 cph*5 | 50 700 cph*5 | - | - |
Placement accuracy
(Cpk 1) | ± 40 µm/chip | ±30 μm / chip
(±25 μm / chip*6) | ±30 μm / chip | ± 30 µm/chip
± 30 µm/QFP 12mm to 32mm 12mm Under | ± 30 µm/QFP |
Component
dimensions
(mm) | (01005") 0402 chip*7 to L 6 x W 6 x T 3 | 03015"*7*8/(01005") 0402 chip*7 to L 6 x W 6 x T 3 | (01005") 0402 chip*7 to L 12 x W 12 x T 6.5 | (01005") 0402 chip*7 to L 32 x W 32 x T 12 | (0201") 0603 chip to L 100 x W 90 x T 28 |
Component
supply | Taping | Tape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 8 to 56 / 72 / 88 / 104 mm |
| 8 mm tape : Max. 68 (8 mm thin type single feeder, double tape feeder, small reel) |
| Stick,Tray | - | Stick : Max. 8
Tray : Max. 20 (per tray feeder) |
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*13 |
| Adhesive position accuracy (Cpk1) | ± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) |
| Resolution | 18 µm | 9 µm |
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 |
Inspection
processing
time | Solder
Inspection *9 | 0.35s/ View size |
Component
Inspection *9 | 0.5s/ View size |
Inspection
object | Solder
Inspection *9 | Chip component : 100 μm x 150 μm or more (0603 / 0201" or more)
Package component : φ150 μm or more | Chip component : 80 μm x 120 μm or more (0402 / 01005" or more)
Package component : φ120 μm or more |
Component
Inspection *9 | Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 |
Inspection
items | Solder
Inspection *9 | Oozing, blur, misalignment, abnormal shape, bridging |
Component
Inspection *9 | Missing, shift, flipping, polarity, foreign object inspection *11 |
Inspection position accuracy *12
( Cpk1) | ± 20 μm | ± 10 μm |
No. of
inspection | Solder
Inspection *9 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) |
Component
Inspection *9 | Max. 10 000 pcs./machine |
*1 : Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) dual lane specs cannot be established.
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 : Excluding monitor and signal tower
*5 : It is the reference value of the tact time by the IPC9850 conformity. (The independent mode)
*6 : ±25 μm placement support option.(Under conditions specified by PFSC)
*7 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFC : Placement accuracy ±30 μm / chip )
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*13 : A PCB height measurement time of 0.5s is included.
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
