Surface Mount Technology: CM602

CM602 design engineers Panasonic
Surface Mount Technology CM602

CM602 placement machine

High-speed and reconfigurable, the CM 602 offers support for next-generation components. Elements of an outstanding solution supporting all types of production.

Achieve outstanding throughput with the Panasonic CM602 high-speed multi-functional placement machine thanks to the high-speed recognition camera, light head and linear motor.

This single-platform solution is completely compatible with Panasonic’s high-performance CM series feeder units, nozzles and operation. Select the most suitable combination of high-speed and multi-functional heads to enable placement of up to 100,000 components every hour.

Increase your productivity to the highest level with the intelligent, fast and extremely versatile CM602.


  • Any type of production can benefit from the one -platform solution
  • Compatible with already existing equipment
  • Reliability is increased and maintenance reduced thanks to the linear motor drive
  • Broad component capability starting at 0402 (01005) chips to 90 x 100 mm on up to boards of 18" x 20"

Features & Benefits

Wide range of variations
The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
*Heads can be changed after purchase.

Improves actual productivity with lighter high-speed head and new optimization
Lighter high-speed head and new manufacturing sequence optimization has increased productivity by 7 % compared to the former optimization model Ver.4.

New high-flexibility 8 nozzles head Further component handling capability
The generalized Ver.5 (optional) expands existing component range. A wide variety of components, ranging from a 0402 chip to 50mm and a large size connector (100× 50mm),have become mountable.
The 3D sensor and direct tray feeder can be installed as before providing superior handling capabilities for odd-shaped components.

Improves area productivity with compact feeder carts

Increases placement reliability by the 3D sensor

High-quality placement for IC component via the 3D sensor
High-speed detection via batch scanning.

Multifunctional transfer unit supporting POP and C4
Highly versatile unit accurately transfers solder/flux for POP top packaging/C4 mounting on the bump side.

Quick changeover capabilities

High modular compatibility
High compatibility with CM402 series realized through modular manufacturing concept.


Model IDCM602-L
Model No.NM-EJM8A
PCB dimensions (mm)L 50 x W 50 to L 510 x W 460
High-speed head12 nozzles
Max.speed100 000 cph (0.036 s/chip <Type A-2>)
Placement accuracy±40 µm/chip (Cpk1)
Component dimensions (mm)(01005") 0402 chip *5 to L 12 mm × W 12 mm × T 6.5 mm
High-flexibility headLS 8 nozzles
Max.speed75 000 cph (0.048 s/chip <Type A-0>)
Placement accuracy±40 µm/chip, ±35 µm/QFP 24 mm,
±50 µm/QFP <24 mm (Cpk1)
Component dimensions (mm)(01005”) 0402 chip *5 to L 32 mm × W 32 mm × T 8.5 mm *8
When the generalized Ver.5 is optionally selected (01005”)0402 chip *5 to L 100 mm × W 50 mm × T 15 mm *6
Multi-functional head3 nozzles
Max.speed20 000 cph (0.18 s/QFP <Type B-0>)
Placement accuracy±35 µm/QFP (Cpk1)
PCB exchange time0.9 s (Board length:up to 240 mm Under optimum conditions)
Electric source3-phase AC 200, 220, 380, 400, 420, 480 V, 4.0 kVA
Pneumatic source *10.49 MPa, 170 L /min(A.N.R.)
Dimensions (mm)W 2 350 x D 2 290 *2 x H 1 430 *3
Mass *43 400 kg

*1:Only for main body
*2:Dimension D including direct tray feeder:2 565 mm
*3:Excluding monitor and signal tower
*4:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
*5:The 0402 chip requires a specific nozzle/feeder.
*6:When T is more than 11.5mm,special nozzles are needed.Please consult us separately.
*7:When T is more than 21mm,special nozzles are needed.Please consult us separately.
*8:When T is more than 6.5mm,special nozzles are needed.Please consult us separately.
*Values such as maximum speed and placement accuracy may vary depending on operating conditions.
*Please refer to the "Specification" booklet for details.

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