Surface Mount Technology: CM602
CM602 placement machine
High-speed and reconfigurable, the CM 602 offers support for next-generation components. Elements of an outstanding solution supporting all types of production.
Achieve outstanding throughput with the Panasonic CM602 high-speed multi-functional placement machine thanks to the high-speed recognition camera, light head and linear motor.
This single-platform solution is completely compatible with Panasonic’s high-performance CM series feeder units, nozzles and operation. Select the most suitable combination of high-speed and multi-functional heads to enable placement of up to 100,000 components every hour.
Increase your productivity to the highest level with the intelligent, fast and extremely versatile CM602.
- Any type of production can benefit from the one -platform solution
- Compatible with already existing equipment
- Reliability is increased and maintenance reduced thanks to the linear motor drive
- Broad component capability starting at 0402 (01005) chips to 90 x 100 mm on up to boards of 18" x 20"
Features & Benefits
Wide range of variations
The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
*Heads can be changed after purchase.
Improves actual productivity with lighter high-speed head and new optimization
Lighter high-speed head and new manufacturing sequence optimization has increased productivity by 7 % compared to the former optimization model Ver.4.
New high-flexibility 8 nozzles head Further component handling capability
The generalized Ver.5 (optional) expands existing component range. A wide variety of components, ranging from a 0402 chip to 50mm and a large size connector (100× 50mm),have become mountable.
The 3D sensor and direct tray feeder can be installed as before providing superior handling capabilities for odd-shaped components.
Improves area productivity with compact feeder carts
Increases placement reliability by the 3D sensor
High-quality placement for IC component via the 3D sensor
High-speed detection via batch scanning.
Multifunctional transfer unit supporting POP and C4
Highly versatile unit accurately transfers solder/flux for POP top packaging/C4 mounting on the bump side.
Quick changeover capabilities
High modular compatibility
High compatibility with CM402 series realized through modular manufacturing concept.
|PCB dimensions (mm)||L 50 x W 50 to L 510 x W 460|
|High-speed head||12 nozzles|
|Max.speed||100 000 cph (0.036 s/chip <Type A-2>)|
|Placement accuracy||±40 µm/chip (Cpk1)|
|Component dimensions (mm)||(01005") 0402 chip *5 to L 12 mm × W 12 mm × T 6.5 mm|
|High-flexibility head||LS 8 nozzles|
|Max.speed||75 000 cph (0.048 s/chip <Type A-0>)|
|Placement accuracy||±40 µm/chip, ±35 µm/QFP 24 mm,|
±50 µm/QFP <24 mm (Cpk1)
|Component dimensions (mm)||(01005”) 0402 chip *5 to L 32 mm × W 32 mm × T 8.5 mm *8|
When the generalized Ver.5 is optionally selected (01005”)0402 chip *5 to L 100 mm × W 50 mm × T 15 mm *6
|Multi-functional head||3 nozzles|
|Max.speed||20 000 cph (0.18 s/QFP <Type B-0>)|
|Placement accuracy||±35 µm/QFP (Cpk1)|
|PCB exchange time||0.9 s (Board length:up to 240 mm Under optimum conditions)|
|Electric source||3-phase AC 200, 220, 380, 400, 420, 480 V, 4.0 kVA|
|Pneumatic source *1||0.49 MPa, 170 L /min(A.N.R.)|
|Dimensions (mm)||W 2 350 x D 2 290 *2 x H 1 430 *3|
|Mass *4||3 400 kg|
*1:Only for main body
*2:Dimension D including direct tray feeder:2 565 mm
*3:Excluding monitor and signal tower
*4:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
*5:The 0402 chip requires a specific nozzle/feeder.
*6:When T is more than 11.5mm,special nozzles are needed.Please consult us separately.
*7:When T is more than 21mm,special nozzles are needed.Please consult us separately.
*8:When T is more than 6.5mm,special nozzles are needed.Please consult us separately.
*Values such as maximum speed and placement accuracy may vary depending on operating conditions.
*Please refer to the "Specification" booklet for details.
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