Factory Automation: Surface Mount Technology

Surface Mount Technology design engineers Panasonic

Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.

Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.

Manufacturers require easily adaptable, modular and efficient solutions in order to remain competitive in industry today. For this reason, Panasonic’s complete solutions go far further than just our equipment. Our multidisciplinary approach of uniting our software, engineering and after-sales support lets us offer your company a whole range of services starting at spare parts, training, technical support and service through to MES software, engineering services, custom systems, calibration and certification as well as complete corporate consulting.


  • AM100Single-head, high-mix placement. Reels at 35,800 cph. 160 8mm.
  • NPM-D3Dual lane placement, dispensing, printing, and inspecting. 70,000 cph. 120 8mm reels.
  • NPM-W2From XL to small tandem board placement. 70,000 cph. 120 8mm reels.
  • NPM-TTTwin-tray and PoP placement. 36,000 cph. 86 (52) 8mm reels. 20 (40) trays.

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