Features & Benefits
High-speed, uniform parallel plate plasma cleaner
- Fast - up to 360 substrates/strips per hour
- Highly productive - inline processing for improved bonding, over molding and underfill
- Semi S2/S8 compliant
- Ar, O2 or mixed gas plasma
- The reason why an extra-thin gold plated electrode can be used
When a extra-thin gold plated electrode is used, nickel compounds are formed on a surface after the heat treatment by the die-bonding cure. These nickel compounds impair the wire bonding performance, thus it is said that a thin gold plated electrode is unsuitable for wire bonding. However, the argon plasma treatment eliminates the nickel compounds, therefore stable wire bonding can be performed on an extra-thin and extra-cheap gold plated electrode.
Surface reforming by oxygen plasma
Surface reforming by oxygen radical improves mold resin adhesion and under-fill wettability. (Option)
Transfer system options
M type transfer system, loader, and unloader
S type transfer system, loader, and unloader
|Cleaning methed||Parallel plate RF back-sputtering method|
|Gas for electrical discharge *1||Ar [option : O2]|
|Substrate dimensions (mm)||L 50 x W 20 to L 250 x W 75 *2 incl. S type option|
L 50 x W 20 to L 330 x W 120 incl. M type option
|Substrate thickness (mm)||0.5 to 2.0|
|Dimensions (mm) / Mass *3||W 930 x D 1100 x H 1 450 / 555 kg|
W 1 764 x D 1 100 x H 1 450 / 850 kg incl. S type option
W 1 764 x D 1 100 x H 1 450 / 770 kg incl. M type option
|Power source *4||1-phase AC 200 V, 2.00 kVA [Full Load 5.00 kVA]|
|Pneumatic source||0.49 MPa or more, 6.5 L/min [A.N.R.]|
*1: If the optional oxygen gas is selected as a discharge gas, nitrogen gas is also required to dilute exhaust.
*2: For W 70.1mm to W 75mm, the electrode in the chamber is required separately.
*3: Tolerance of equipment dimensions is ±5mm, Touch panel and condition lamp is not included. Mass varies depending on configuration.
*4: Compatible with 1-phase 208/220/230/240 V
*Please refer to the specifications on details.