Features & Benefits
Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding
Die bonding is carried out immediately after Epoxy dispensing, thereby marking it possible to finish the bonding operation before the Epoxy is deteriorated over time.
This realizes stable and high quality bonding at all bond positions on a substrate.
Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die (OP).
This system allows you to realize manufacturing with real-time quality-inspection.
The large-sized thouch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
|Productivity *1||0.56 s/die (under the fastest condetion)|
|Placement accuracy *1||XY : ±15 µm, : ±0.3° (3 at PFSC condition)|
|Substrate dimensions (mm)||L 50 x W 30 to L 200 x W 140|
(Option : L loader / unloader maximum of 280, Size can be changed.)
|Die dimensions (mm)||L 0.25 x W 0.25 to L 6 x W 6|
|Number of Die types||5 types (water supply), 10 type (tray supply)|
|Configuration of die feeder||Flat rings, pre-expanding rings or trays (fed to a dedicated pallet)|
|Number of nozzles||Max. 24 nozzles (Pick-up nozzles, Bonding nozzle, stamping tool)|
|Power source *2||3-phase AC 200 V ±10V, 50/60 Hz, 4 kVA|
|Pneumatic source||0.5 MPa, 30 L/min [A.N.R.]|
|Dimensions (mm)||W 1 950 x D 1 190 x H 1 720 (including loader / unloader)|
(Machine body : W 1 190 x D 1 190 x H 1 1720)
|Mass||2 200 kg (including loader / unloader)|
*1 The above described productivity and bonding accuracy may differ depending on the conditions of use.
*2 Three-phase 208 / 220 / 380 / 400 / 415 / 480
*For details, refer to the spcification manual.