Microelectronics: Die Bonder MD-P200

Die Bonder MD-P200 design engineers Panasonic
Die Bonder MD-P200 Microelectronics

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.

The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.

Features & Benefits

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding
Die bonding is carried out immediately after Epoxy dispensing, thereby marking it possible to finish the bonding operation before the Epoxy is deteriorated over time.
This realizes stable and high quality bonding at all bond positions on a substrate.
Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die (OP).
This system allows you to realize manufacturing with real-time quality-inspection.

Friendly Operation
The large-sized thouch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Specifications

Model IDMD-P200
Model No.NM-EFD1B
Productivity *10.56 s/die (under the fastest condetion)
Placement accuracy *1XY : ±15 µm, : ±0.3° (3 at PFSC condition)
Substrate dimensions (mm)L 50 x W 30 to L 200 x W 140
(Option : L loader / unloader maximum of 280, Size can be changed.)
Die dimensions (mm)L 0.25 x W 0.25 to L 6 x W 6
Number of Die types5 types (water supply), 10 type (tray supply)
Configuration of die feederFlat rings, pre-expanding rings or trays (fed to a dedicated pallet)
Number of nozzlesMax. 24 nozzles (Pick-up nozzles, Bonding nozzle, stamping tool)
Power source *23-phase AC 200 V ±10V, 50/60 Hz, 4 kVA
Pneumatic source0.5 MPa, 30 L/min [A.N.R.]
Dimensions (mm)W 1 950 x D 1 190 x H 1 720 (including loader / unloader)
(Machine body : W 1 190 x D 1 190 x H 1 1720)
Mass2 200 kg (including loader / unloader)

*1 The above described productivity and bonding accuracy may differ depending on the conditions of use.
*2 Three-phase 208 / 220 / 380 / 400 / 415 / 480
*For details, refer to the spcification manual.