Visit Panasonic Factory Solutions at SMT 2015

May 5, 2015 to May 7, 2015 Event

Panasonic introduces latest developments for SMT placement and Semiconductor technology.

Date: 
May 5, 2015 to May 7, 2015
Location: 
Hall 7 – Booth 329, Exhibition Centre Nuremberg

Panasonic introduces latest developments for SMT placement and Semiconductor technology. 

Panasonic as one of the major player in SMT manufacturing will show the latest model of its modular production equipment to realize Any-Mix-Any-Volume production.
Besides the SMT placement machines, Panasonic is showing the MDP-300, the new Flip-Chip bonder.
Panasonic Products at the SMT

  • NPM-W2, developed to comply with the manufacturing requirement of any kind of industry, such as Automotive industry, Mobile Phones manufacturer, AV industry and any others. The NPM-W2 is designed to handle very small chip components up to large components like connectors and can be used to place components on PCB with a length of up to 1200mm.
  • MDP-300, the new model of Panasonics Flip-Chip bonder for the semi conductor industry.

We are looking forward to your visit at our booth!